Advantage of Flip Chip COB LEDs

Flip-Chip is one of the chip packaging technologies. This packaging technology mainly differs from the previous method of chip packaging. In the past, the chip was placed on a substrate, and using the gold wire to connect chips and the junction point on the substrate. Whereas in the Flip Chip packaging technology, chips have to be connected with bump, and be flipped over to make the bump directly connect with the substrate.

Advantage of Flip Chip COB LED:
1. High Reliability and Stability. Flip-Chip COB LEDs do not require gold wires, and the probability of light failure caused by gold wire breaking is reduced by 90%, thus ensuring product stability. Compared with the gold wire, its electrical contact surface is expanded by more than 1000 times, the current density is increased by 10,000 times, and the chip thrust will increase to 2000g. So the reliability of the entire packaged device will be higher.
2. High Luminous Intensity with small luminous area. Flip Chip device volume can be reduced by up to 80%, and it can achieve greater luminous flux in the same size compared to regular LEDs.
3. High Heat Dissipation. Flip chip is soldered by direct contact between metal and metal and its high current dissipation capability is better than conventional packaging. The conventional packaging is cooled through sapphire and solid crystal silver glue, but the flip chip is cooled only through the metal channel, so the heat dissipation is faster than conventional packaging.